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Design your Motherboard and I/O board

We design custom motherboards and IO boards tailored to your exact specifications, giving you the edge to outperform the competition.

 

From ultra-compact footprints to highly customized I/O layouts, we deliver the precise engineering your project demands. ​

 

Contact us to discuss your custom motherboard today.

Process
Overview

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Phase 1

Project Kick Off

Goal: Align on all technical, commercial, and logistical requirements, ensuring a solid foundation for the project.

 

Input:

- Project summary & product positioning. [Decision Required]

- Form factor & mechanical constraints. [Decision Required]

- Detailed Technical Specification. [Decision Required]

- IC Development / Reference Board or Tool. [Decision Required]

- Packing Requirements. [Information Only]

- Timeline requirements. [Decision Required]

 

Responsibilities:

- Conduct stakeholder interviews to align on project goals and constraints.

- Analyze technical and market requirements to formulate a comprehensive technical brief.

- Formalize the service scope and project timeline.

 

Deliverables:

- Design Requirement Agreement (DRA)

- Mutual Non-Disclosure Agreement (NDA)

- Project Schedule & Milestones

- Communication protocol & point-of-contact

- Contract

 

Milestone Checkpoint:

✓ DRA and contract signed, project officially kicked off. [Approval / Sign-off]

Goal: Select, verify, and document all key components, establishing a stable and cost-effective supply chain.

 

Input:

- Preferred/specified key ICs (CPU/Chipset). [Decision Required]

- Critical materials list. [Information Only]

- Component EOL (End-of-Life) timeline. [Information Only]

- Target Cost Review. [Approval / Sign-off]

 

Responsibilities:

- Source and verify component/connector datasheets and footprints.

- Analyze EOL and supply chain risks for all critical parts.

- Develop a preliminary block diagram of the system architecture.

 

Deliverables:

- Block Diagram

- Mutually Verified component/connector List (AVL)

 

Milestone Checkpoint:

✓ Mutually Verified Component List and Block Diagram approved. [Approval / Sign-off]

Phase 2

Build Component Library

Phase 3

Placement Simulation

Goal: Create a feasible component placement map that balances mechanical constraints, thermal performance, and signal integrity.

 

Input:

- Mechanical files (STP/STEP). [Decision Required]

- Enclosure constraints and keep-out zones. [Decision Required]

 

Responsibilities:

- Integrate mechanical constraints with the electronic component layout.

- Perform pre-simulation for signal integrity (SI) and thermal hotspots.

- Define PCB stack-up and material strategy.

 

Deliverables:

- Preliminary Placement Map

- Stack-up Recommendation

- Simulation Report (Thermal, SI)

 

Milestone Checkpoint:

✓ Preliminary Placement Map and Simulation Report approved. [Approval / Sign-off]

Goal: Translate the schematic and placement into a fully routable, manufacturable, and reliable PCB design.

 

Input:

- Finalized Specification Freeze. [Approval / Sign-off]

Our Responsibilities:

- Execute high-speed PCB layout following best practices for signal integrity.

- Conduct comprehensive DFM, DFA, and DFT reviews.

- Prepare final manufacturing files and Bill of Materials for prototyping.

 

Deliverables:

- EVT Gerber Files

- Layout Review Documentation

- SI/PI/ESD/EMI/DFM/ME Preview

- EVT BOM

 

Milestone Checkpoint:

✓ EVT Gerber files and EVT BOM released for fabrication. [Approval / Sign-off]

Phase 4

PCB Layout

Phase 5

Engineering Verification Test - First Prototype

Goal: Build and validate the first functional prototypes, verifying the core design and identifying areas for improvement.

 

Input:

- Enclosure/Chassis for test fitting. [Decision Required]

- Prototyping materials and budget confirmation. [Approval / Sign-off]

 

Responsibilities:

- Manage prototype PCB fabrication and assembly (PCBA).

- Execute board bring-up, BIOS/firmware flashing, and functional testing.

- Track all identified hardware and software bugs.

 

Deliverables:

- EVT Samples

- BIOS / Firmware / Function Test Report

- Bug List Tracking Table

- BOM Update

- Drivers

 

Milestone Checkpoint:

✓ EVT samples validated and design revisions approved for DVT. [Approval / Sign-off]

Goal: Verify the design against all functional, performance, and environmental requirements using production-grade components.

 

Input:

- EVT Review feedback. [Decision Required]

- Final Certification requirements. [Decision Required]

Our Responsibilities:

- Build DVT units using production-intent components and processes.

- Conduct a full suite of verification tests (Stress, Compatibility, Reliability, etc.).

- Manage and support pre-certification testing with third-party labs.

 

Deliverables:

- DVT Samples

- Verification Reports (Function, CPU Stress, Compatibility, Reliability, Safety/Regulatory, OS Testing)

- Certification Processes & Support

Milestone Checkpoint:

✓ DVT passed and design frozen for mass production. [Approval / Sign-off]

Phase 6

Design Verification & Compliance Testing

Phase 7

PVT & Production Readiness

Goal: Ensure the design is fully prepared for mass production and provide all necessary documentation to the manufacturer.

 

Phase 7.1 | Production Verification Test (PVT)

Input:

- DVT Review feedback. [Decision Required]

- Specified/recommended manufacturing facility. [Decision Required]

- MP (Mass Production) sign-off. [Approval / Sign-off]

- Packing SOP confirmation. [Approval / Sign-off]

 

Responsibilities:

- Prepare production fixtures and Standard Operating Procedures (SOP).

- Execute a small-batch trial production run on the actual production line.

- Validate production process feasibility, efficiency, and quality.

 

Deliverables:

- Production SOP

- Test Fixture Preparation

- Factory-ready Production Data Package

- PVT Test Report

 

Milestone Checkpoint:

✓ PVT passed and process approved for mass production. [Approval / Sign-off]

Phase 7.2 | Engineering Documentation Handover

Input:

- Final approval of all engineering documents. [Approval / Sign-off]

- Confirmation of manufacturing partner for handover. [Decision Required]

 

Responsibilities:

- Compile and organize the complete "Golden Package" documentation set.

- Conduct a final review meeting to walk through all deliverables with the client and manufacturer.

 

Deliverables:

- Design Source: Schematic & Layout

- BOM: Approved Vendor List and Second Source

- Software: BIOS, Firmware, and Drivers

- Test Report Summary (Consolidated reports from EVT, DVT, and PVT stages)

- Certification Documents

- Manufacturing: Final Production Gerber, Drill files, Pick & Place, Stencil File, Fixture Suggestion

 

Milestone Checkpoint:

✓ Golden Package delivered and final sign-off completed. [Approval / Sign-off]

Manufacturing & Support Service

Add-Ons

Manufacturing Training and Skill Transfer

Motherboard Mass Production Management

CKD (Completely Knocked Down) Shipment Models

Design Your Motherboard | Design Your Chassis | Design Your Complete System |

Thin mini-ITX Motherboard | Thin Mini-ITX Mini PC |  

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