Process
Overview
Phase 1
Planning & Specification
Goal: To establish a unified product vision and a detailed technical/commercial framework that guides the entire system development process.
Input:
- Market Positioning, Target Cost, and Timeline Requirements. [Decision Required]
- Core Functions, User Scenarios, and Competitive Advantages. [Decision Required]
- Reference Samples or Preferred ID Styles. [Information Only]
Responsibilities:
- Conduct stakeholder interviews to align on system-level goals.
- Develop a comprehensive Product Marketing Specification (MRS).
- Define the high-level system architecture and technology platform.
Deliverables:
- Product Marketing Specification (MRS)
- Design Requirement Agreement (DRA)
- Mutual Non-Disclosure Agreement (NDA)
- Project Schedule & Milestones
- NRE and Contract
Milestone Checkpoint:
✓ MRS, DRA, and contract signed; project officially kicked off. [Approval / Sign-off]
Goal: To simultaneously develop the electronic and mechanical systems, ensuring seamless integration and manufacturability from day one.
Phase 2.1 | EE Design (Schematic & Layout)
Input:
- Preferred/specified key ICs (CPU/Chipset). [Decision Required]
Responsibilities:
- Develop schematic, select components (AVL), and create block diagram.
- Perform placement simulation and high-speed PCB layout.
Deliverables:
- Schematic, Block Diagram, and Verified Component List (AVL)
- EVT Gerber Files and EVT BOM
Milestone Checkpoint:
✓ The project consists of three key milestones: Architectural Definition (IC selection and schematics), Design Validation (simulations and PCB layout), and EVT Readiness (delivery of Gerber files and BOM for prototype production).
Phase 2.2 | ME Design (ID & Mechanical)
Input:
- Surface finish and texture preference. [Decision Required]
Responsibilities:
- Develop 2D concept sketches and 3D styling models.
- Define CMF and create detailed 3D part/assembly files.
- Initiate long-lead-time tooling fabrication.
Deliverables:
- 3D Model Files and Renderings
- CMF Document
- Prototype Build Confirmation
Milestone Checkpoint:
✓ EVT Gerber and ME 3D design files released for prototyping. [Approval / Sign-off]
Phase 2
Motherboard & Mechanical Concurrent Design
Phase 3
EVT - System Prototype Testing
Goal: To build and validate the first fully integrated system prototypes, verifying the core EE/ME design and identifying integration issues.
Input:
- Approval for prototype build and budget. [Approval / Sign-off]
Responsibilities:
- Manage PCBA fabrication and rapid prototyping of enclosures (CNC/3D printing).
- Assemble first system prototypes and perform board bring-up.
- Conduct system-level functional tests and pre-certification scans (EMI, Thermal).
Deliverables:
- EVT System Samples (3-5 units)
- System Bring-up & Function Test Report
- Integrated Bug List (EE, ME, BIOS)
- Preliminary EMI, Thermal, and DFM Reports
- Tooling Kick-off Confirmation
Milestone Checkpoint:
✓ EVT samples validated and design revisions approved for DVT. [Approval / Sign-off for System Design lock]
Goal: To verify the complete system design against all functional, performance, and environmental requirements using production-grade components and tooling.
Input:
- EVT review feedback and final certification requirements. [Decision Required]
Responsibilities:
- Build DVT units using production-intent components and T2/Tn molds.
- Conduct a full suite of system verification tests (Stress, Compatibility, Reliability).
- Manage and support formal certification testing (Safety, EMI, WHQL).
Deliverables:
- DVT System Samples (10-20 units)
- Full System Verification Report
- Tooling Trial (T2/Tn) Report
- Certification Application & Support
Milestone Checkpoint:
✓ DVT passed and system design frozen for mass production. [Approval / Sign-off for tooling design lock]
Phase 4
DVT - Design Verification & Compliance
Phase 5
PVT &
Production Readiness
Goal: To validate the manufacturing process and ensure the design is fully prepared for stable, high-volume production.
Input:
- Mass Production (MP) sign-off. [Approval / Sign-off]
Responsibilities:
- Prepare production fixtures and Standard Operating Procedures (SOP).
- Execute a small-batch trial run on the actual production line (FAI).
- Validate production process feasibility, yield, and quality.
Deliverables:
- Production SOP & Test Fixture Preparation
- First Article Inspection (FAI) Report
- PVT Test Report
Milestone Checkpoint:
✓ PVT passed and process approved for mass production. [Approval / Sign-off]
Goal: To transition the product to stable mass production and deliver a complete engineering data package.
Input:
- Final approval of all engineering documents. [Approval / Sign-off]
Responsibilities:
- Launch formal mass production and monitor yield.
- Compile and organize the complete "Golden Package" documentation set.
Deliverables:
- Design Source: 3D/2D Mechanical Files
- BOM: Final Approved Vendor List (AVL)
- Software: Final BIOS, Firmware, and Drivers
- Test Reports: Consolidated EVT/DVT/PVT Reports
- Certification Documents
- Manufacturing Package: Gerber, Assembly Instructions, SOP, etc.
Milestone Checkpoint:
✓ Golden Package delivered and product in stable mass production. [Approval / Sign-off]
Phase 6
Mass Production & Documentation Handover
Certification Support
CE, FCC, RoHS, Energy Star, TCO, EPEAT, Low Blue Light, MIL-STD
Manufacturing & Support Service
Add-Ons
Manufacturing Training and Skill Transfer
Motherboard Mass Production Management
CKD (Completely Knocked Down) Shipment Models