Process
Overview
Phase 1
Project Kick Off
Goal: Align on all technical, commercial, and logistical requirements to establish a solid foundation for the project.
Input:
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Project summary & product positioning
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Form factor & mechanical constraints
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Detailed technical specification
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IC development / reference board or tool
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Packing requirements
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Timeline requirements
Responsibilities:
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Conduct stakeholder interviews to align on project goals and constraints
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Analyze technical and market requirements to formulate a comprehensive technical brief
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Formalize the service scope and project timeline
Deliverables:
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Design Requirement Agreement (DRA)
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Mutual Non-Disclosure Agreement (NDA)
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Project Schedule & Milestones
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Communication protocol & point-of-contact
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Contract
Milestone Checkpoint:
✅ DRA and contract signed, project officially kicked off.
Goal: Select, verify, and document all key components, establishing a stable and cost-effective supply chain.
Input:
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Preferred/specified key ICs (CPU/Chipset).
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Critical materials list.
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Component EOL (End-of-Life) timeline.
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Target Cost Review.
Responsibilities:
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Source and verify component/connector datasheets and footprints.
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Analyze EOL and supply chain risks for all critical parts.
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Develop a preliminary block diagram of the system architecture.
Deliverables:
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Block Diagram
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Mutually Verified component/connector List (AVL)
Milestone Checkpoint:
✅ Mutually Verified Component List and Block Diagram approved.
Phase 2
Build Component Library
Phase 3
Placement Simulation
Goal: Create a feasible component placement map that balances mechanical constraints, thermal performance, and signal integrity.
Input:
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Mechanical files (STP/STEP).
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Enclosure constraints and keep-out zones.
Responsibilities:
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Integrate mechanical constraints with the electronic component layout.
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Perform pre-simulation for signal integrity (SI) and thermal hotspots.
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Define PCB stack-up and material strategy.
Deliverables:
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Preliminary Placement Map
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Stack-up Recommendation
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Simulation Report (Thermal, SI)
Milestone Checkpoint:
✅ Preliminary Placement Map and Simulation Report approved.
Goal: Translate the schematic and placement into a fully routable, manufacturable, and reliable PCB design.
Input:
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Finalized Specification Freeze. [Approval / Sign-off]
Our Responsibilities:
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Execute high-speed PCB layout following best practices for signal integrity.
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Conduct comprehensive DFM, DFA, and DFT reviews.
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Prepare final manufacturing files and Bill of Materials for prototyping.
Deliverables:
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EVT Gerber Files
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Layout Review Documentation
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SI/PI/ESD/EMI/DFM/ME Preview
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EVT BOM
Milestone Checkpoint:
✅ EVT Gerber files and EVT BOM released for fabrication.
Phase 4
PCB Layout
Phase 5
Engineering Verification Test - First Prototype
Goal: Build and validate the first functional prototypes, verifying the core design and identifying areas for improvement.
Input:
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Enclosure/Chassis for test fitting.
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Prototyping materials and budget confirmation.
Responsibilities:
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Manage prototype PCB fabrication and assembly (PCBA).
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Execute board bring-up, BIOS/firmware flashing, and functional testing.
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Track all identified hardware and software bugs.
Deliverables:
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EVT Samples
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BIOS / Firmware / Function Test Report
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Bug List Tracking Table
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BOM Update
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Drivers
Milestone Checkpoint:
✅ EVT samples validated and design revisions approved for DVT.
Goal: Verify the design against all functional, performance, and environmental requirements using production-grade components.
Input:
- EVT Review feedback. [Decision Required]
- Final Certification requirements. [Decision Required]
Our Responsibilities:
- Build DVT units using production-intent components and processes.
- Conduct a full suite of verification tests (Stress, Compatibility, Reliability, etc.).
- Manage and support pre-certification testing with third-party labs.
Deliverables:
- DVT Samples
- Verification Reports (Function, CPU Stress, Compatibility, Reliability, Safety/Regulatory, OS Testing)
- Certification Processes & Support
Milestone Checkpoint:
✓ DVT passed and design frozen for mass production. [Approval / Sign-off]
Phase 6
Design Verification & Compliance Testing
Phase 7
PVT & Production Readiness
Goal: Ensure the design is fully prepared for mass production and provide all necessary documentation to the manufacturer.
Phase 7.1 | Production Verification Test (PVT)
Input:
- DVT Review feedback. [Decision Required]
- Specified/recommended manufacturing facility. [Decision Required]
- MP (Mass Production) sign-off. [Approval / Sign-off]
- Packing SOP confirmation. [Approval / Sign-off]
Responsibilities:
- Prepare production fixtures and Standard Operating Procedures (SOP).
- Execute a small-batch trial production run on the actual production line.
- Validate production process feasibility, efficiency, and quality.
Deliverables:
- Production SOP
- Test Fixture Preparation
- Factory-ready Production Data Package
- PVT Test Report
Milestone Checkpoint:
✓ PVT passed and process approved for mass production. [Approval / Sign-off]
Phase 7.2 | Engineering Documentation Handover
Input:
- Final approval of all engineering documents. [Approval / Sign-off]
- Confirmation of manufacturing partner for handover. [Decision Required]
Responsibilities:
- Compile and organize the complete "Golden Package" documentation set.
- Conduct a final review meeting to walk through all deliverables with the client and manufacturer.
Deliverables:
- Design Source: Schematic & Layout
- BOM: Approved Vendor List and Second Source
- Software: BIOS, Firmware, and Drivers
- Test Report Summary (Consolidated reports from EVT, DVT, and PVT stages)
- Certification Documents
- Manufacturing: Final Production Gerber, Drill files, Pick & Place, Stencil File, Fixture Suggestion
Milestone Checkpoint:
✓ Golden Package delivered and final sign-off completed. [Approval / Sign-off]